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シングルGaNナノ細線デバイスのための接触界面の解析
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Engineering
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JoVE Journal
Engineering
Analysis of Contact Interfaces for Single GaN Nanowire Devices
Please note that all translations are automatically generated.
Click here for the English version.
シングルGaNナノ細線デバイスのための接触界面の解析
DOI:
10.3791/50738-v
•
11:13 min
•
November 15, 2013
•
Andrew M. Herrero
,
Paul T. Blanchard
,
Kris A. Bertness
1
Quantum Electronics and Photonics Division
,
National Institute of Standards and Technology
Chapters
00:05
Title
01:32
Wafer Preparation
03:14
Photolithography of Contact Pattern
04:55
Electron-beam Evaporation of Contact Metals
06:29
Contact Metal Lift-off and Annealing
07:38
Ni/Au Film Removal
09:04
Results: Annealed Ni/Au Films Removed with Carbon Tape
10:45
Conclusion
Summary
Automatic Translation
English (Original)
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Automatic Translation
技術は、単一のGaNナノワイヤーデバイスの接触/基板とコンタクト/ NWインタフェースの検査と特徴付けを可能にするために、それらの基質からのNi / Auのコンタクト金属膜を除去するように開発された。
Tags
GaN Nanowire
Contact Interface
Void Formation
Contact Metal Removal
Ni/Au Contacts
SiO2 Substrate
Contact Adhesion
Contact Morphology
Residual Contamination
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