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Chapters
- 00:05Title
- 01:32Wafer Preparation
- 03:14Photolithography of Contact Pattern
- 04:55Electron-beam Evaporation of Contact Metals
- 06:29Contact Metal Lift-off and Annealing
- 07:38Ni/Au Film Removal
- 09:04Results: Annealed Ni/Au Films Removed with Carbon Tape
- 10:45Conclusion
