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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
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February 08, 2022
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A protocol for metal-assisted chemical imprinting of 3D microscale features with sub-20 nm shape accuracy into solid and porous silicon wafers is presented.
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Sharstniou, A., Niauzorau, S., Junghare, A., Azeredo, B. P. Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers. J. Vis. Exp. (180), e61040, doi:10.3791/61040 (2022).
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