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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Engineering
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JoVE Journal Engineering
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

DOI:
10.3791/52623-v

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08:21 min

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March 20, 2015

•

,
1Center for Microsystems Technology (CMST),Ghent University-imec

Chapters

  • 00:05Title
  • 01:48Micro-bumping Using Laser-induced Forward Transfer
  • 03:52Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
  • 05:23Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
  • 06:28Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
  • 07:50Conclusion

Summary

Automatic Translation

Automatic Translation

We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

Tags

Flip-chip PackagingLaser-induced Forward Transfer (LIFT)Single DiesBumpingConductive BumpsMicro-electronicsCost-effectiveFlexibilityHigh SpeedAccuracy

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