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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
JoVE Journal
工学
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JoVE Journal 工学
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

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08:21 min

March 20, 2015

DOI:

08:21 min
March 20, 2015

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概要

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We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

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