ジャーナル
/
/
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
JoVE Journal
工学
このコンテンツを視聴するには、JoVE 購読が必要です。  サインイン又は無料トライアルを申し込む。
JoVE Journal 工学
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

12,144 Views

08:21 min

March 20, 2015

DOI:

08:21 min
March 20, 2015

1 Views
,

概要

Automatically generated

We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

Read Article