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Laser-indotta Transfer Forward per Flip-chip Packaging di Dies Singolo
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JoVE Journal Engineering
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Laser-indotta Transfer Forward per Flip-chip Packaging di Dies Singolo

italiano

Automatically Generated

12,144 Views

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08:21 min

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March 20, 2015

DOI:

10.3791/52623-v

DOI:
10.3791/52623-v

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08:21 min
March 20, 2015

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1 Views
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1Center for Microsystems Technology (CMST),Ghent University-imec

Summary

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Dimostriamo l'uso della Forward Transfer (LIFT) tecnica laser-indotta per l'assemblaggio flip-chip componenti optoelettronici. Questo approccio fornisce un conveniente, a bassa temperatura semplice, soluzione veloce e flessibile per la messa a passo urti e incollaggio sul chip-scala per raggiungere i circuiti ad alta densità per applicazioni optoelettroniche.

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Cite this Article

Kaur, K. S., Van Steenberge, G. Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies. J. Vis. Exp. (97), e52623, doi:10.3791/52623 (2015).

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