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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Chapters
- 00:05Title
- 01:48Micro-bumping Using Laser-induced Forward Transfer
- 03:52Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
- 05:23Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
- 06:28Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
- 07:50Conclusion
We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.
