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激光诱导转发转移单人死于倒装芯片封装
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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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激光诱导转发转移单人死于倒装芯片封装

12,143 Views

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08:21 min

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March 20, 2015

DOI:

10.3791/52623-v

DOI:
10.3791/52623-v

•

08:21 min
March 20, 2015

•

1 Views
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1Center for Microsystems Technology (CMST),Ghent University-imec

Summary

Automatically generated

我们演示了如何使用激光诱导转发转移（LIFT）技术光电元器件的倒装芯片组装的。这种方法提供了一种简单，经济有效的，低的温度下，细间距凸点和粘结片上大规模用于光电应用实现高密度电路快速且灵活的解决方案。

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Flip-chip PackagingLaser-induced Forward Transfer (LIFT)Single DiesBumpingConductive BumpsMicro-electronicsCost-effectiveFlexibilityHigh SpeedAccuracy

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Cite this Article

Kaur, K. S., Van Steenberge, G. Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies. J. Vis. Exp. (97), e52623, doi:10.3791/52623 (2015).

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