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リング本体の温度上昇問題に対処するための2つの温度場解きモジュールの比較

JoVE Journal
Engineering

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JoVE Journal Engineering

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

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リング本体の温度上昇問題に対処するための2つの温度場解きモジュールの比較

166 Views

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02:52 min

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July 05, 2024

DOI:

10.3791/202126-v

DOI:

10.3791/202126-v

•

02:52 min

July 05, 2024

•

18 Views

Xiang Wang¹, Qianxi Sun¹, Chengji Lu², Minkai Zhang², Jiangcheng Jin², Linsen Mu³, Enlin Li³, Anxin Wang³, Mingge Wu^1,2,3,4

¹College of Mechanical and Electrical Engineering,Wenzhou University, ²Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, ³Wecome Intelligent Manufacturing Co., Ltd., ⁴College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

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