Journal
/
工程学
/
A Comprehensive Approach to Investigate RMU Temperature Rise Problem
/
Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit
JoVE 杂志
工程学
需要订阅 JoVE 才能查看此.  登录或开始免费试用。
JoVE 杂志 工程学
Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

163 Views

•

02:52 min

•

July 05, 2024

DOI:

10.3791/202126-v

DOI:
10.3791/202126-v

•

02:52 min
July 05, 2024

•

18 Views
, , , , , , , ,
1College of Mechanical and Electrical Engineering,Wenzhou University, 2Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, 3Wecome Intelligent Manufacturing Co., Ltd., 4College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

Explore More Videos

Ring Main UnitRMUTemperature RiseHeat DissipationFinite Element SimulationOhmic LossesTemperature Field AnalysisConvective Heat TransferSimulation ResultsEngineering DesignMultiphysics Coupling AnalysisElectrical Equipment Optimization

Read Article

Cite this Article

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit. J. Vis. Exp. (Pending Publication), e202126, doi:10.3791/202126 (2024).

Download .ris file

Copy

Share Video

.

Copy