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Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit
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Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

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02:52 min

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July 05, 2024

DOI:

10.3791/202126-v

DOI:
10.3791/202126-v

•

02:52 min
July 05, 2024

•

18 Views
, , , , , , , ,
1College of Mechanical and Electrical Engineering,Wenzhou University, 2Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, 3Wecome Intelligent Manufacturing Co., Ltd., 4College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

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Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit. J. Vis. Exp. (Pending Publication), e202126, doi:10.3791/202126 (2024).

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