/

/

/

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

JoVE Revista
Ingeniería

Se requiere una suscripción a JoVE para ver este contenido. Inicie sesión o comience su prueba gratuita.

JoVE Revista Ingeniería

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

163 Views

•

02:52 min

•

July 05, 2024

DOI:

10.3791/202126-v

DOI:

10.3791/202126-v

•

02:52 min

July 05, 2024

•

18 Views

Xiang Wang¹, Qianxi Sun¹, Chengji Lu², Minkai Zhang², Jiangcheng Jin², Linsen Mu³, Enlin Li³, Anxin Wang³, Mingge Wu^1,2,3,4

¹College of Mechanical and Electrical Engineering,Wenzhou University, ²Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, ³Wecome Intelligent Manufacturing Co., Ltd., ⁴College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

Explore More Videos

Ring Main Unit RMU Temperature Rise Heat Dissipation Finite Element Simulation Ohmic Losses Temperature Field Analysis Convective Heat Transfer Simulation Results Engineering Design Multiphysics Coupling Analysis Electrical Equipment Optimization

Read Article