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Capítulos
- 00:05Título
- 01:21Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C84 in Si Substrate
- 02:57Measurements of Electronic Properties of C84-embedded Si Substrate
- 05:07Measurements of Surface Magnetism
- 06:17Measurements of Nanomechanical Properties by AFM
- 06:49Measurement of Nanomechanical Properties by Molecular Dynamics Simulation
- 11:05Results: Characterization of C84-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation
- 12:46Conclusion
