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1Department of Mechanical Engineering,University of Hong Kong, 2Department of Mechanical Engineering,University of Michigan, 3Department of Electrical Engineering and Computer Science,University of Michigan, 4Department of Chemistry,University of Hong Kong, 5HKU-Shenzhen Institute of Research and Innovation
Chapters
- 00:05Title
- 01:27Photolithography-based Fabrication of an Embedded Metal-mesh Transparent Electrode (EMTE)
- 05:14Electron-beam Lithography-based Fabrication of a Sub-micron EMTE
- 07:44EMTE Characterization
- 08:33Results: EMTE Fabrication by the Lithography, Electroplating, and Imprint Transfer (LEIT) Method
- 10:05Conclusion
Dit protocol beschrijft een op oplossings gebaseerde fabricage-strategie voor high-performance, flexibele, transparante elektroden met volledig ingebed, dik metaalnetwerk. Flexibele transparante elektroden vervaardigd door dit proces tonen onder de hoogste gerapporteerde prestaties, waaronder ultra-lage velweerstand, hoge optische transmissie, mechanische stabiliteit onder buigen, sterke substraathechting, oppervlak gladheid en milieubestabiliteit.
