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Bonding solvente per la fabbricazione di PMMA e COP dispositivi microfluidici
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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
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Bonding solvente per la fabbricazione di PMMA e COP dispositivi microfluidici

15,747 Views

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04:54 min

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January 17, 2017

DOI:

10.3791/55175-v

DOI:
10.3791/55175-v

•

04:54 min
January 17, 2017

•

23 Views
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1Department of Mechanical & Industrial Engineering,University of Toronto, 2Institute of Biomaterials and Biomedical Engineering (IBBME),University of Toronto

Summary

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Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.

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Cite this Article

Wan, A. M. D., Moore, T. A., Young, E. W. K. Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices. J. Vis. Exp. (119), e55175, doi:10.3791/55175 (2017).

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