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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
JoVE Journal
工学
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JoVE Journal 工学
Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

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04:54 min

January 17, 2017

DOI:

04:54 min
January 17, 2017

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概要

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Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.

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