Journal
/
Ingenieurwesen
/
Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
JoVE Journal
Ingenieurwesen
Zum Anzeigen dieser Inhalte ist ein JoVE-Abonnement erforderlich.  Melden Sie sich an oder starten Sie Ihre kostenlose Testversion.
JoVE Journal Ingenieurwesen
Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

DOI:
10.3791/51179-v

•

10:32 min

•

January 09, 2014

•

, , , ,
1Department of Physics,The State University of New York at Buffalo, 2Joint Quantum Institute,University of Maryland, 3The National Institute of Standards and Technology, 4Cryogenics and Fluids Branch,NASA Goddard Space Flight Center, 5HRL Laboratories

Kapitel

  • 00:05Titel
  • 01:54Bonding Preparation
  • 04:38Wafer Bonding
  • 08:04Results: Analysis of Bonded Wafers
  • 09:59Conclusion

Summary

Automatische Übersetzung

Automatische Übersetzung

A method for permanently bonding two silicon wafers so as to realize a uniform enclosure is described. This includes wafer preparation, cleaning, RT bonding, and annealing processes. The resulting bonded wafers (cells) have uniformity of enclosure ~1%1,2. The resulting geometry allows for measurements of confined liquids and gasses.

Tags

Silicon Direct Wafer BondingNanoscale CavitiesConfined 4HeLambda TransitionUniform ConfinementThermal OxideLithographic PatterningRCA CleaningHigh-temperature AnnealingThermal And Hydrodynamic Properties

Article

Embed

ZUR WIEDERGABELISTE HINZUFÜGEN

Usage Statistics

Verwandte Videos

Fabrication And Characterization Of Photonic Crystal Slow Light Waveguides And Cavities

Concurrent Quantitative Conductivity and Mechanical Properties Measurements of Organic Photovoltaic Materials using AFM

Patterning via Optical Saturable Transitions – Fabrication and Characterization

Thermal Measurement Techniques in Analytical Microfluidic Devices

Prescribed 3-D Direct Writing of Suspended Micron/Sub-micron Scale Fiber Structures via a Robotic Dispensing System

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens

Fabrication of Magnetic Nanostructures on Silicon Nitride Membranes for Magnetic Vortex Studies Using Transmission Microscopy Techniques

Fabrication of Three-Dimensional Graphene-Based Polyhedrons via Origami-Like Self-Folding

Fabrication of Robust Nanoscale Contact between a Silver Nanowire Electrode and CdS Buffer Layer in Cu(In,Ga)Se2 Thin-film Solar Cells

Read Article