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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
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July 03, 2020
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An experimental methodology based on thermal and rheological measurements is proposed to characterize the curing process of adhesives with to obtain useful information for industrial adhesive selection.
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Díaz-Díaz, A., Sánchez-Silva, B., Tarrío-Saavedra, J., López-Beceiro, J., Gómez-Barreiro, S., Artiaga, R. Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing. J. Vis. Exp. (161), e61468, doi:10.3791/61468 (2020).
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