JoVE Journal
Engineering
Engineering
È necessario avere un abbonamento a JoVE per visualizzare questo Contenuto. Accedi o inizia la tua prova gratuita.
Capitoli
Riepilogo
We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.