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流变和热测试对粘合系统固化的评价

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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

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流变和热测试对粘合系统固化的评价

DOI:

10.3791/61468-v

•

09:06 min

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July 03, 2020

•

Ana Díaz-Díaz*¹, Barbara Sánchez-Silva*¹, Javier Tarrío-Saavedra*¹, Jorge López-Beceiro*¹, Silvia Gómez-Barreiro*¹, Ramon Artiaga*¹

¹Escola Politécnica Superior,Universidade da Coruña

Capítulos

00:05Introduction
00:41Manufacturer Curing Condition Checking: Thermogravimetric Cured Sample Testing
01:20Manufacturer Curing Condition Checking: Differential Scanning Calorimetry (DSC) of a Cured Sample
02:29DSC Fresh Sample Analysis: Ramp Curing Test
03:23DSC Fresh Sample Analysis: Isothermal Curing Test
04:47Logarithmic Strain Sweep Test
05:27Isothermal Multifrequency Curing Test
06:22Torque sweep and Temperature Scan Testing
07:18Results: Representative Cured Adhesive System Rheological and Thermal Testing
08:42Conclusion

Summary

Tadução automática

提出了一种基于热和流变测量的实验方法，用于描述粘合剂的固化过程，为工业胶粘剂的选择获取有用的信息。

Tags

Keywords: Adhesive Systems Curing Process Rheological Testing Thermal Analysis Thermogravimetric Analysis Differential Scanning Calorimetry Quality Control Adhesive Selection Curing Study Heating-cooling-heating Test

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