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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

9,864 Views

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08:46 min

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April 13, 2016

DOI:

10.3791/53683-v

DOI:
10.3791/53683-v

•

08:46 min
April 13, 2016

•

7 Views
, , , , , ,
1Materials Engineering Division,Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs,Intel Corporation, 3Advanced Light Source,Lawrence Berkeley National Laboratory

Tags

Synchrotron Radiation Microtomography3D ImagingMicroelectronic PackageNon-destructive EvaluationMicrometer ScaleSample MountingSample AlignmentMagnification SelectionX-ray EnergyPolychromatic Beam

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Carlton, H. D., Elmer, J. W., Li, Y., Pacheco, M., Goyal, D., Parkinson, D. Y., MacDowell, A. A. Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages. J. Vis. Exp. (110), e53683, doi:10.3791/53683 (2016).

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