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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

9,890 Views

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08:46 min

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April 13, 2016

DOI:

10.3791/53683-v

DOI:
10.3791/53683-v

•

08:46 min
April 13, 2016

•

2 Views
, , , , , ,
1Materials Engineering Division,Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs,Intel Corporation, 3Advanced Light Source,Lawrence Berkeley National Laboratory

Summary

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For this study synchrotron radiation micro-tomography, a non-destructive three-dimensional imaging technique, is employed to investigate an entire microelectronic package with a cross-sectional area of 16 x 16 mm. Due to the synchrotron's high flux and brightness the sample was imaged in just 3 min with an 8.7 µm spatial resolution.

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Cite this Article

Carlton, H. D., Elmer, J. W., Li, Y., Pacheco, M., Goyal, D., Parkinson, D. Y., MacDowell, A. A. Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages. J. Vis. Exp. (110), e53683, doi:10.3791/53683 (2016).

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