A Comprehensive Approach to Investigate RMU Temperature Rise Problem

A Comprehensive Approach to Investigate RMU Temperature Rise Problem

July 05, 2024

环网柜温升模拟的比较研究

比较两个温度场求解模块以解决环形主机的温升问题

Xiang Wang¹, Qianxi Sun¹, Chengji Lu², Minkai Zhang², Jiangcheng Jin², Linsen Mu³, Enlin Li³, Anxin Wang³, Mingge Wu^1,2,3,4

¹College of Mechanical and Electrical Engineering,Wenzhou University, ²Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, ³Wecome Intelligent Manufacturing Co., Ltd., ⁴College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

Summary

该文通过建立简化模型并在两个温度场求解模块中进行比较分析，解决了环网柜的温升问题。

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