Comparative Study of Simulation of Temperature Rise in Ring Main Unit

Xiang Wang; Qianxi Sun; Chengji Lu; Minkai Zhang; Jiangcheng Jin; Linsen Mu; Enlin Li; Anxin Wang; Mingge Wu

doi:10.3791/66643

Journal

Ingenieurwesen

A Comprehensive Approach to Investigate RMU Temperature Rise Problem

July 05, 2024

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

01:45 min

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208 Views

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

02:52 min

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163 Views

Xiang Wang¹, Qianxi Sun¹, Chengji Lu², Minkai Zhang², Jiangcheng Jin², Linsen Mu³, Enlin Li³, Anxin Wang³, Mingge Wu^1,2,3,4

¹College of Mechanical and Electrical Engineering,Wenzhou University, ²Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, ³Wecome Intelligent Manufacturing Co., Ltd., ⁴College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics

Summary

This paper addresses the temperature rise problem of the ring main unit by establishing a simplified model and conducting a comparative analysis in two temperature field-solving modules.

A Comprehensive Approach to Investigate RMU Temperature Rise Problem

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

Summary

Article