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硫酸铜镀液中铜离子的积累与分析

JoVE 杂志
化学

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JoVE 杂志化学

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

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硫酸铜镀液中铜离子的积累与分析

DOI:

10.3791/59376-v

•

07:00 min

•

March 20, 2019

•

Toshiaki Koga, Yoshitaro Sakata, Nao Terasaki

¹Advanced Manufacturing Research Institute, Department of Electronics and Manufacturing,National Institute of Advanced Industrial Science and Technology (AIST)

Chapters

00:04Title
01:00Formation of the Cu(I) in The Plating Solution
02:48Quantitative Measurement of the Cu(I)
03:46Injection Measurement of Cu(I) and BCS Color Reaction Curves
04:46Results: Analysis of the Cuprous Ions from the Copper Sulfate Plating Solution
06:17Conclusion

Summary

自动翻译

本文介绍了硫酸铜镀液中铜离子的积累, 并在定量测量的基础上进行了分析。本实验再现了镀液中铜离子的积累过程。

Tags

Keywords: Copper Sulfate Plating Solution Monovalent Copper Quantification Optical Evaluation Nitrogen Gas Copper Plate Platinum Plate Power Supply UV-Vis Spectrophotometer

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