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エレクトロスタンプによる局所的なバスレス金属複合めっき
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Chemistry
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JoVE Journal Chemistry
Localized Bathless Metal-Composite Plating via Electrostamping
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エレクトロスタンプによる局所的なバスレス金属複合めっき

3,953 Views

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08:05 min

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September 22, 2020

DOI:

10.3791/61484-v

DOI:
10.3791/61484-v

•

08:05 min
September 22, 2020

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1Department of Chemistry and Biochemistry,St. Mary’s College of Maryland, 2PMA-265 Power and Propulsion IPTL

Tags

ElectroplatingElectrostampingMetal-composite CoatingFluorescent CoatingNickel SulfateNickel ChlorideBoric AcidEuropiumDysprosiumStrontium AluminateYttrium OxideBarium Magnesium AluminateAnodeCathodePotassium HydroxideSodium HydroxideAcid ActivationCurrent Efficiency

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Townsend, T. K., Hancock, J., Russell, C., Shaw, J. P. Localized Bathless Metal-Composite Plating via Electrostamping. J. Vis. Exp. (163), e61484, doi:10.3791/61484 (2020).

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