Here we present a protocol for the fabrication of inkjet-printed multilayer sensor structures on additively manufactured substrates and foil.
A method to combine additively manufactured substrates or foils and multilayer inkjet printing for the fabrication of sensor devices is presented. First, three substrates (acrylate, ceramics, and copper) are prepared. To determine the resulting material properties of these substrates, profilometer, contact angle, scanning electron microscope (SEM), and focused ion beam (FIB) measurements are done. The achievable printing resolution and suitable drop volume for each substrate are, then, found through the drop size tests. Then, layers of insulating and conductive ink are inkjet printed alternately to fabricate the target sensor structures. After each printing step, the respective layers are individually treated by photonic curing. The parameters used for the curing of each layer are adapted depending on the printed ink, as well as on the surface properties of the respective substrate. To confirm the resulting conductivity and to determine the quality of the printed surface, four-point probe and profilometer measurements are done. Finally, a measurement set-up and results achieved by such an all-printed sensor system are shown to demonstrate the achievable quality.
Additive manufacturing (AM) is standardized as a process where materials are joined to make objects from 3D model data. This is usually done layer upon layer and, thus, contrasts with subtractive manufacturing technologies, such as semiconductor fabrication. Synonyms include 3D-printing, additive fabrication, additive process, additive techniques, additive layer manufacturing, layer manufacturing, and freeform fabrication. These synonyms are reproduced from the standardization by the American Society of Testing and Materials (ASTM)1 to provide a unique definition. In the literature, 3D-printing is referred to as the process where thickness of the printed objects is in the range of centimeters to even meters2.
More common processes, such as stereolithography3, enable the printing of polymers, but the 3D-printing of metal is also already commercially available. The AM of metals is employed in manifold areas, such as for the automotive, aerospace4, and medical5 sectors. An advantage for aerospace structures is the possibility to print lighter devices through simple structural changes (e.g., by using a honeycomb design). Consequently, materials with, for instance, greater mechanical strength, that would otherwise add a significant amount of weight (e.g., titanium instead of aluminum)6, can be employed.
While the 3D-printing of polymers is already well established, metal 3D-printing is still a vibrant research topic, and a variety of processes have been developed for the 3D-printing of metal structures. Basically, the available methods can be combined into four groups7,8, namely 1) using a laser or electron beam for cladding in a wire-fed process, 2) sintering systems using a laser or electron beam, 3) selectively melting powder using a laser or electron beam (powder bed fusion), and 4) a binder jetting process where, commonly, an inkjet print head moves over a powder substrate and dispenses binding agent.
Depending on the process, the respective manufactured samples will exhibit different surface and structural properties7. These different properties will have to be considered in further efforts to further functionalize the printed parts (e.g., by fabricating sensors on their surfaces).
In contrast to 3D-printing, the printing processes to achieve such a functionalization (e.g., screen and inkjet printing) cover only limited object heights from less than 100 nm9 up to a few micrometers and are, thus, often also referred to as 2.5D-printing. Alternatively, laser-based solutions for high-resolution patterning have also been proposed10,11. A comprehensive review of the printing processes, the thermally dependent melt temperature of nanoparticles, and the applications is given by Ko12.
Although screen printing is well established in the literature13,14, inkjet printing provides an improved upscaling ability, together with an increased resolution for the printing of smaller feature sizes. Besides that, it is a digital, noncontact printing method enabling the flexible deposition of functional materials on three-dimensional. Consequently, our work is focused on inkjet printing.
Inkjet printing technology has already been employed in the fabrication of metal (silver, gold, platinum, etc.) sensing electrodes. Application areas include temperature measurement15,16, pressure and strain sensing17,18,19, and biosensing20,21, as well as gas or vapor analysis22,23,24. The curing of such printed structures with limited height extension can be done using various techniques, based on thermal25, microwave26, electrical27, laser28, and photonic29 principles.
Photonic curing for inkjet-printed structures allows researchers to use high-energy, curable, conductive inks on substrates with a low-temperature resistance. Exploiting this circumstance, the combination of 2.5D- and 3D-printing processes can be employed to fabricate highly flexible prototypes in the area of smart packaging30,31,32 and smart sensing.
The conductivity of 3D-printed metal substrates is of interest to the aerospace sector, as well as for the medical sector. It does not just improve the mechanical stability of certain parts but is beneficial in near-field as well as capacitive sensing. A 3D-printed metal housing provides additional shielding/guarding of the sensor's front-end since it can be electrically connected.
The aim is to fabricate devices using AM technology. These devices should provide a sufficiently high resolution in the measurement they are employed for (often at micro- or nanoscale) and, at the same time, they should fulfill high standards regarding reliability and quality.
It has been shown that AM technology presents the user with enough flexibility to fabricate optimized designs33,34 which improve the overall measurement quality that can be achieved. Additionally, the combination of polymers and single-layer inkjet printing has been presented in previous research35,36,37,38.
In this work, available studies are extended, and a review about the physical properties of AM substrates, with a focus on metals,and their compatibility with multilayer inkjet printing and photonic curing is provided. An exemplary multilayer coil design is provided in Supplementary Figure 1. The results are used for providing strategies for the inkjet printing of multilayer sensor structures on AM metal substrates.
CAUTION: Before using the considered inks and adhesives, please consult the relevant Material Safety Data Sheets (MSDS). The employed nanoparticle ink and adhesives may be toxic or carcinogenic, dependent on the filler. Please use all appropriate safety practices when performing inkjet printing or the preparation of samples and make sure to wear appropriate personal protective equipment (safety glasses, gloves, lab coat, full-length pants, closed-toe shoes).
NOTE: The protocol can be paused after any step except steps 6.3 – 6.6 and steps 9.2 – 9.5.
1. Preparation of 3D-printed Substrates
2. Fabrication of Interconnects
NOTE: The fabrication of interconnects differs depending on the type (conductive/nonconductive) of substrate.
3. Preparation of the Inkjet Printing System
4. Inspection of the Surface Properties of the Respective Substrates for Printability and the Adjustment of Printer Parameters for the First Layer
5. Curing Parameter Adjustments for the First Layer
6. Inkjet Printing and Curing of the First Device Layer
7. Inspection of the Surface Properties of the Respective Substrates for Printability and the Adjustment of Printer Parameters for Subsequent Layers
NOTE: Please refer to the user manuals of the measurement equipment to perform the profilometer measurements and microscopy inspections.
8. Curing Parameter Adjustments for Subsequent Layers
9. Inkjet Printing and Curing of Subsequent Device Layers
From the SEM images shown in Figure 1, conclusions on the printability on the respective substrates can be drawn. The scale bars are different due to the different ranges of the surface roughness. In Figure 1a, the surface of the copper substrate is shown, which is by far the smoothest. Figure 1c, on the other hand, shows steel, a substrate which is not usable for inkjet printing due to the high porosity and unstable contact angle (see also Table 2). In Figure 1b, an SEM image of the bronze substrate is shown, and in Figure 1d, the titanium sample surface is illustrated.
In Figure 2 and Figure 3, the results of the profilometer measurements are given. These evaluations are necessary to determine the surface roughness of the respective substrates. The metal substrates with a roughness well above ~1 µm (aluminum, titanium, and steel) are not usable for inkjet printing, as the ink tends to be absorbed due to the high porosity and, therefore, inhibits the fabrication of homogeneous layers and reproducible structures. The alumina-based ceramic substrate has a comparable roughness, but due to the different fabrication process, does not exhibit such high surface porosities and can, thus, be used.
Drop size tests, such as illustrated qualitatively in Figure 4 and gathered quantitatively in Table 3, give the achievable drop size and, thus, also the wettability properties for the respective substrate and ink combination. Substrates where no distinct drops are formed either have too little wettability (this is true for the AM metals with a low surface roughness), or they are too porous (this is true for the AM metals with a high surface roughness [e.g., Figure 4d]). In Figure 4a, the printing result on bronze is illustrated. Figure 4b shows copper, Figure 4c shows ceramics, and Figure 4d illustrates the steel sample result.
In Figure 5, microscopic images of the results after the curing of a conductive layer of 1 mm width on insulating ink are given. Based on these images, the integrity of the prints can be assessed. For the conductive ink on copper (Figure 5b), the best result can be achieved; the conductive track on aluminum (Figure 5a) is completely destroyed; the conductive tracks printed onto the ceramic substrates (Figure 5c, d) are intact, but show delamination. The delamination is due to the weak heat absorption and high reflection of the substrates. Reducing the curing dose on these substrates yields conductive tracks which have improved electrical and structural properties.
To determine the height profiles and surface quality of the printed multilayer structures, height profiles, which are the results of profilometer measurements, are gathered, as given in Figure 6 and Figure 7, using the profilometer. From these height profiles, the surface homogeneity of the conductive tracks (the smoothness of the blue curves) can be determined. Additionally, surfaces which lost their structural integrity (aluminum, titanium) can be identified by the large gradients in their height profiles.
The FIB analyses with copper (Figure 8a), bronze (Figure 8b), titanium (Figure 8c), and brass (Figure 8d) are shown to illustrate a sufficient bulk homogeneity of AM metal substrates. The scale bars are different here in order to optimally capture the structural characteristics of the multilayer prints (deficiencies in homogeneity, conductive track, etc.). This ensures sufficient electrical conductivity of the substrates so that these can be used for shielding in magnetic and capacitive sensing applications. Results for the achieved sheet resistance using a four-point probe are gathered in Table 4. Additionally, a qualitative assessment of the printed layers is possible. The granular structures are formed by cured nanoparticles and the layer below is the insulating ink. In, for instance, Figure 8b, we see nonhomogeneities (holes, air inclusions) in the printed layers. These result from outgassing during curing. Outgassing can occur when the cure dose for conductive ink on insulating ink is too high. This effect negatively influences the integrity of the printed structures, and excessive outgassing leads to destruction.
In Figure 9, measurements results are shown. These results are gathered using a demonstrator which employs a capacitive sensing principle. The smoothness of the curves illustrates the high achievable quality despite the structural deficiencies that might result from the printing processes.
Figure 1: SEM images of the metallic substrates. These images show (a) copper, (b) bronze, (c) steel, and (d) titanium. They are taken at different magnifications as illustrated by the scale bar in the lower right corner of each image. Based on these images, the surface homogeneity can be assessed. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 2: Profilometer measurements of metallic and ceramic AM substrates. The roughness values Ra and Rq in nanometers are determined according to ISO 4287. For silver, the values are 689.39 nm and 788.06 nm, respectively; for aluminum, they are 2151.19 nm and 2750.38 nm, respectively; for alumina-based (Al2O3) substrates, they are 1210.47 nm and 1737.6 nm, respectively; for zirconia-based (ZrO2) substrates, they are 559.97 nm and 681.56 nm. The waviness is the more widely spaced surface texture of the substrate. The waviness is the remaining texture in-homogeneity with the roughness component removed. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 3: Profilometer measurements of metallic substrates. The Ra and Rq values for the respective substrates are, for brass, 414.2 nm and 494.49 nm, respectively; for titanium, 1099.86 nm and 1448.06 nm, respectively; for copper, 307.63 nm and 358.92 nm, respectively; for steel, 1966.95 nm and 2238.78 nm, respectively. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 4: Drop size tests for metallic and ceramic substrates. These images show (a) bronze, (b) copper, (c) ZrO2, and (d) steel. Distinct drops measured here are marked (where possible) by arrows in the respective image. The determined drop sizes are gathered in Table 3. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 5: Microscopic images of conductive ink printed onto an insulator and an AM metal substrate after photonic curing. The substrates are (a) aluminum, (b) copper, (c) Al2O3, and (d) ZrO2. The width of the conductive structure in each image is w = 1 mm. The integrity of the conductive structure on aluminum is completely destroyed, whereas the structures on copper and Al2O3 remain intact. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 6: Height profiles for the conductive tracks on the insulator for metal substrates, determined using the profilometer. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 7: Height profiles for the conductive tracks on metal and ceramic substrates, determined using the profilometer. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 8: FIB images of conductive ink on the insulator and metallic substrates. These images show (a) copper, (b) bronze, (c) titanium, and (d) brass. This figure has been modified from Faller et al.41. Please click here to view a larger version of this figure.
Figure 9: Plot of the measurement results from a demonstrator device fabricated following the suggested methodology. Please click here to view a larger version of this figure.
minimum details/ mm |
minimum accuracy/ % featuresize |
process | |
Silver | 0.25 | 5.00 | wax 3D-printing & lost wax casting |
Titanium | 0.1 | 0.2 | direct metal laser sintering |
Steel | 0.35 | 2 to 3 | chemical binding & sintering @ 1300 °C |
Bronze | 0.35 | 5.00 | wax 3D-printing & lost wax casting |
Brass | 0.35 | 5.00 | wax 3D-printing & lost wax casting |
Aluminum | 0.25 | 0.2 | direct metal laser sintering |
Copper | 0.35 | 5.00 | wax 3D-printing & lost wax casting |
Al2O3 | 0.025-0.1 | 0.04 | LCM-Technology |
ZrO2 | 0.025-0.1 | 0.04 | LCM-Technology |
Table 1: 3D-printing processes' limitations and tolerances. This table has been modified from Faller et al.41.
titanium | steel | bronze | brass | copper | |
ac / ° | 85.9 | 71.15 | 100.3 | 100.03 | 88.54 |
σa | 7.27 | 17.64 | 3.17 | 2.25 | 6.84 |
Table 2: Gathered contact angles ac and their standard deviation σa in degrees. This table has been modified from Faller et al.41.
titanium | bronze | brass | copper | Al2O3 | ZrO2 | |
dropsize/ µm | 23.97 | 31.3 | 36.04 | 29.03 | 69 | 69.3 |
Table 3: Gathered drop diameters dd in micrometers.This table has been modified from Faller et al.41.
r□ in mΩ/□ | Comments | |
Titanium | 3000 | |
Steel | 600 | |
Bronze | 2000 | |
Brass | 300 | |
Aluminium | 30000 | |
Copper | 180 | |
Al2O3 | 150.00 | different energy used for photonic curing: 527 mJ/cm² |
ZrO2 | 20.00 | conductive track ablated |
Table 4: Gathered sheet resistances r□ in mΩ/□. Sheet resistances are denoted using a square (□) index meaning ohms per square. This term generally refers to 2D-structures and, thus, also implies that the current flow is along the plane of the sheet. The sheet resistance can be multiplied by the film thickness to give the bulk resistivity. This table has been modified from Faller et al.41.
Video 1: LCM process. This process is used to fabricate the ceramic substrates (footage courtesy of Lithoz). Please click here to view this video. (Right-click to download.)
Supplementary Figure 1: Example of a multilayer coil design. Please click here to download this figure.
Supplementary Figure 2: Example of computer-aided design (CAD) drawings, used for the 3D- printing of multilayer coil structures. Please click here to download this figure.
Supplementary Figure 3: An example of computer-aided design (CAD) drawings, used for the 3D- printing of multi-electrode capacitive sensors. Please click here to download this figure.
A way to fabricate multilayer sensor structures on 3D-printed substrates and on foil is demonstrated. AM metal, as well as ceramic and acrylate type and foil substrates are shown to be suitable for multilayer inkjet printing, as the adhesion between the substrate and the different layers is sufficient, as well as the respective conductivity or insulation capability. This could be shown by printing layers of conductive structures on insulating material. Furthermore, the printing and curing processes for all layers was successfully performed without impairing each other.
The fabrication strategies presented in this work are highly sensitive to the interplay of the different materials and surface properties. Consequently, the reproducibility of the performed steps is dependent on the respective manufacturing process. For the preparation of the used AM materials, it needs to be considered that the surface and bulk properties may vary significantly depending on the fabrication method (Figure 1 and Table 2). For the inkjet printing, the proposed parameters have to be carefully adjusted to the used printing system, as well as to the respective inks42,43,44. The jettability of different Ag nanoparticle inks may vary significantly, depending on the formulation. This means that the ink's solvents and certain additives determine its specific viscosity, surface tension, and boiling point.
Another point to consider is the agglomeration of solid content when the ink ages or is not stored properly, which can distort the jetting quality. Besides that, the specific set-up of the print head itself is also crucial, especially the dimensions of the nozzle opening. It determines the actual jetting parameters, such as the jetting voltage, waveform, and temperature setpoint, as well as the resulting drop size (Figure 4 and Table 3). During the printing process itself, a heated substrate table might also increase the temperature of the print head because of the spatial proximity, resulting in a change and possible degradation of the printing behavior. Therefore, it is crucial to monitor the print head temperature during processing.
Another factor which might influence the jetting behavior during printing is the ink pressure as it might have to be decreased as the ink level lowers during processing. The fabrication of the interconnects on a conductive substrate is not trivial, as the dispensed insulating layer has to have a sufficient thickness to avoid short circuits, but still needs to leave sufficient space to form the interconnects using conductive solder paste.
Furthermore, the adhesion between the three materials has to be acceptable to form stable vias. During the curing process, the temperature tolerance of the insulating layer needs to be considered as well. Therefore, low-temperature curing solder paste has been employed for the respective interconnects. After printing the functional layers, they need to be cured to yield the desired sheet resistance (Table 4). Thermal sintering is an appropriate and effective method for the silver patterns if the substrate or the underlying layer has a sufficiently high-temperature tolerance45. This is not the case for the insulating layers, which is why photonic curing is employed (Figure 5). During the photonic curing process, a large amount of energy is transferred to the sample. Therefore, it is crucial to ensure that the printed patterns have sufficiently dried before the curing process as, otherwise, the remaining solvents might reach their boiling point and may destroy the printed layers due to liquid expansion and the formation of bubbles (Figure 8).
Furthermore, sufficient drying is necessary to create layers of homogenous thickness (Figure 6 and Figure 7). Homogenous thickness is necessary for applications where nanometer measurements based on, for instance, a capacitive principle is employed (Figure 9). Here, a uniform distance from the sensing electrode can significantly affect the quality46.
Overall, it can be stated that the choice of optimal photonic curing parameters for the device layers on an insulator is a crucial factor: if the introduced energy is not sufficient, the conductive ink remains unsintered and the sheet resistance is too high for the devices to be electrically functional; by introducing too much energy, excessive heat will be produced in the film and, consequently, the conductive track is destroyed. The copper substrate yielded the best result in terms of sheet resistance (see Table 4) and also in the achieved surface quality and integrity of the printed metal track. This might be due to its surface roughness being the lowest among all considered substrates. The substrate reflectivity could be identified as influencing the photonic curing result significantly. The respective substrate reflectivity has to be considered in the curing in order to achieve an optimized result with respect to the applied photonic curing spectrum and profile. This has to be adapted for individual substrates and ink combinations.
In this work, the suitability of AM substrates and foil for inkjet printing was demonstrated. Additionally, the material properties together with the factors essential to the process were determined. A strategy to fabricate working sensor prototypes on foil and AM metal and polymer substrates was presented. Finally, the achievable measurement quality based on measurements done with a demonstrator system was shown. This approach forms an important contribution to the future electrical functionalization of surfaces, enclosures, and other structures that have had a solely mechanical purpose in the design of numerous devices so far.
The authors have nothing to disclose.
This work has been supported by the COMET K1 ASSIC Austrian Smart Systems Integration Research Center. The COMET-Competence Centers for Excellent Technologies-Program is supported by BMVIT, BMWFW, and the federal provinces of Carinthia and Styria.
PiXDRO LP 50 | Meyer Burger AG | Inkjet-Printer with dual-head assembly. | |
SM-128 Spectra S-class | Fujifilm Dimatix | Printheads with nozzle diameter of 50 µm, 50 pL calibrated dropsize and 800 dpi maximum resolution. | |
DMC-11610/DMC-11601 | Fujifilm Dimatix | Disposable printheads with nozzle diameter 21.5 µm, 1 or 10 pL calibrated dropsize | |
Sycris I50DM-119 | PV Nanocell | Conductive silver nanoparticle ink with 50 wt.% silver loading, with an average particle size of 120 nm, in triethylene glycol monomethyl ether. | |
Solsys EMD6200 | SunChemical | Insulating, low-k dielectric ink which is a mixture of acrylate-type monomers. Viscosity is 7-9 cps. | |
Dycotec DM-IN-7002-I | Dycotec | UV curable insulator, Surface Tension: 37.4 mN/m | |
Dycotec DM-IN-7003C-I | Dycotec | UV curable insulator, Surface Tension: 29.7 mN/m | |
Dycotec DM-IN-7003-I | Dycotec | UV curable insulator, Surface Tension: 31.4 mN/m | |
Dycotec DM-IN-7004-I | Dycotec | UV curable insulator, Surface Tension: 27.9 mN/m | |
Pulseforge 1200 | Novacentrix | Photonic curing/sintering equipment. | |
DektatkXT | Bruker | Stylus Profiler with stylus tip of 12.5 µm diameter and constant force of 4 mg. | |
C4S | Cascade Microtech | Four-point-probe measurement head. | |
2000 | Keithley | Multimeter to evaluate the measurements using the four-point-probe. | |
Helios NanoLab600i | FEI | Focused Ion Beam analysis station which provides high-energy gallium ion milling. | |
SeeSystem | Advex Instruments | Water contact angle measurement device. | |
Projet 3500 HDMax | 3D Systems | Professional high-resolution polymer 3D-printer. See also (accessed Sep. 2018): https://www.3dsystems.com/sites/default/files/projet_3500_plastic_0115_usen_web.pdf | |
Polytec PU 1000 | Polytec PT | Electrically conductive adhesive based on Polyurethane, available | |
Microdispenser | Musashi | Needle for microdispensing. | |
Micro-assembly station | Finetech | Equipment for assembly of, e.g., printed circuit boards (PCBs) and placing of chemicals (e.g. solder) and SMD parts. |