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Kapitel
- 00:04Titel
- 00:51Preparation of 3D-printed Substrate, Fabrication of Interconnects and Adjustment of Printer Parameters for the First Layer
- 02:53Curing Parameter Adjustments for the First Layer
- 03:44Inkjet Printing and Curing of the First Device Layer
- 04:41Inspection of the Surface Properties of the Respective Substrates for Printability and Inkjet Printing and Curing of Subsequent Device Layers
- 06:37Results: Surface Analyses and Measurement Results from a Capacitive Sensor System Prototype
- 07:50Conclusion
