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通过电子压图进行本地化无浴金属复合电镀
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Localized Bathless Metal-Composite Plating via Electrostamping
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通过电子压图进行本地化无浴金属复合电镀

3,972 Views

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08:05 min

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September 22, 2020

DOI:

10.3791/61484-v

DOI:
10.3791/61484-v

•

08:05 min
September 22, 2020

•

2 Views
, , ,
1Department of Chemistry and Biochemistry,St. Mary’s College of Maryland, 2PMA-265 Power and Propulsion IPTL

Summary

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此处介绍的是无洗澡电镀协议，其中含有复合颗粒的停滞金属盐膏在高负载下被减少为金属复合材料。此方法解决了将复合材料颗粒嵌入金属基质的其他常见电镀形式（喷射、刷子、浴）所面临的挑战。

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Cite this Article

Townsend, T. K., Hancock, J., Russell, C., Shaw, J. P. Localized Bathless Metal-Composite Plating via Electrostamping. J. Vis. Exp. (163), e61484, doi:10.3791/61484 (2020).

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